FR4 1.6MM AND 1.0MM H/H H/O B GRADE PLATE
Min.Order : 5 Pieces Quick Quotation >
Item Details
Product Description
brief introduction:
Rigid FR4 Sheets B grade, Copper Clad Laminate, Laminate Sheet manufacturer / supplier in China, Saling Copper Clad Laminate Sheet /Rigid PCB, Insulation Materials Epoxy G10 Fiberglass Sheet, Cheaper Price Fr4 Epoxy Laminated Sheet for LED & Speaker etc.
Basic Info
· Model NO.: FR4 CCL B Grade
· Solid Content: Fr4 CCL
· Formation Methods: Copper Clad Laminate
· Delivery: 7-10 Working Days
· MOQ: 5 tons
· Type: FR4Copper Clad Laminate Sheet
· Material: Fiberglass+PP+Copper
· Appliction: LED & Speaker
· Customizable: Rigid PCB
· Thermal Rating: H 180
· Classification: Hybrid Insulation Materials
· Color: Yellow
· Origin: China
Product Description
Rigid PCB FR4 Copper Clad Laminate sheet
combines a woven glass fabric and an epoxy resin laminate (tg approximately 130°c) that contains bromine. The product provides consistent quality and good electrical properties under dry and humid conditions, as well as high flexural, impact, and bond strength at room temperatures. This product is suitable for a variety of structural, high humidity, and electrical insulation applications, which include terminal boards, lapping carriers.
2.Specifications:
Thickness: 0.8mm,1.0mm,1.2mm,1.6mm
Thickness of copper:18um, 25um,35um.
Copper: Single side (H/0) and double side (H/H)
Size: 1020mm*1220mm
Features:
1) The end face of foil covered board should be tidy without any delamination
and crackle .
2) B grade will have small bubble, wrinkle, pin hole, deep nick, pitting and glue spot on the copper foil covered surface. Any color changing or dirty can be easily. removed by density 1.02g/cm3 hydrochloric acid or proper organic solution .
3. Applications: Usually used in PCB of computers, home electric appliances and other lines.
FR4 CCL / Copper Clad Laminate Technical Date:
FR4 TECHNICAL DATA SHEET | ||||
NO | ITEM | UNIT | INDEX | |
1 | Surface resistance after damp heat and recovery | MO | 1.3x105 | |
2 | Volume resistivity after damp heat and recovery | MO.m | 1.63x106 | |
3 | Permittivity after damp heat and recovery | / | Max: 5.5 | |
4 | Dissipation factor after damp heat and recovery | / | 0.017 | |
5 | Pulling strength | N | Min: 60 | |
6 | Peel strength after exposure to solvent vapour | N/mm | Min: 1.4 | |
7 | Blistering after 10s heat shock | / | No blistering or delamination | |
8 | Solderability (wetting test) | S | 2 | |
9 | Flexural strength | MPa | Min: 300 | |
10 | Flammability(vertical burning test) | / | FV0 or FV1 | |
11 | Water absorption | mg | Max:5.9 | |
12 | Measling | / | No measling or blistering or delamination | |
13 | Warpage | Bow | mm | Max: 18 |
Twist | Max: 20 | |||
CONTACT US
Terrence Trading Limited
Contact Person: Jo Wan
Mobile Phone: +86-18823363695
Email: terrenetradingltd@foxmail.com
Skype: licpao2324
QQ: 3104221453
Address: Baoan District, Shenzhen, China
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